Welcome to ICMSNT 2018

Welcome to the official website of 2018 3rd International Conference on Materials Science and Nanotechnology (ICMSNT 2018). ICMSNT 2018 is co-organized by Southwest Jiaotong University,Swinburne University of Technology, The University of Auckland and Hong Kong Society of Mechanical Engineers, technically sponsored by Changzhou Institute of Technology, Jiangsu University of Science and Technology and Jiangsu Cultural and Creative Collaborative Innovation Center. The conference will be held at Chengdu, China, from Mar. 29-Apr. 1, 2018!

ICMSNT 2016 and ICMSNT 2017 were successfully held in Seoul and Auckland. ICMSNT 2018 is an international forum for the presentation of technological advances and research results in the fields of Materials Science and Nanotechnology. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome prospected authors submit your new research papers to ICMSNT 2018, and share the valuable experiences with the scientist and scholars around the world.

Latest News!

May 20, 2017 Prof. Stephen M. Hsu from The George Washington University will give a plenary talk on conference!


Prof. Stephen M. Hsu

Submission Method

Electronic Submission System (pdf)

Electronic Contribution System

Abstract Template

For any inquiry about the submission and conference, please feel free to contact us at: icmsnt@smehk.org.

Kindly Notice that only English papers related to Material Science and Nanotechnology will be accepted for peer review.

Important Dates

Abstract submission Deadline: Jan.5, 2018
Abstract acceptance Deadline: Jan.25, 2018
Conference early-bird registration Deadline: Mar. 10, 2018
Conference final program: Mar. 15, 2018
Conference Dates: Mar. 29-Apr. 1 , 2018

 

Publication and Indexing

All the papers will be peer reviewed. Selected presented papers with good quality will be recommended to publish in the special issues of following SCI indexed journals:

1,International Journal of Modern Physics B;

2, Surface Engineering;

3, Tribology International;

          

Organized by

 

Sponsored by